IC Package Test Floating Base Assembly.
Developed BGA (Ball Grid Array) base substrate assembly to take advantage of manual and automated actuation. Zelos optimized the design to improved performance, reliability, and cost effectiveness
Removable Clamshell Assembly.
Zelos Engineers developed the entire removable clamshell assembly.Zelos streamlined the design process reducing cycle time by 40%
Developed BGA (Ball Grid Array) base substrate assembly to take advantage of manual and automated actuation. Zelos optimized the design to improved performance, reliability, and cost effectiveness
Removable Clamshell Assembly.
Zelos Engineers developed the entire removable clamshell assembly.Zelos streamlined the design process reducing cycle time by 40%